WATERLOO, Canada, Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to introduce the Linea S HS2 TDI line scan camera family. Drawing on over four decades of industry leading expertise, this innovative camera series represents a significant breakthrough in next generation TDI technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput. The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range, or full well, according to specific application requirements. This makes it par ticularly ideal for inspecting semiconductor wafers, high density interconnects and flat panel displays, and for life science applications. On-chip binning also enables higher web speeds to boost system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity. Source: BERNAMA News Agency
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